Assignment of Assignor's Interest

Recorded: 2021-08-24 Pages: 3

Assignors

KIM, SUNGJIN

Executed: 2021-08-13

RHO, YOUNGHO

Executed: 2021-08-13

KIM, JINCHEOL

Executed: 2021-08-18

JANG, BYUNGKYU

Executed: 2021-08-18

Assignee

SKC CO., LTD.

84, JANGAN-RO 309BEON-GIL, JANGAN-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF

Covered Property (1)

Packaging Substrate and Semiconductor Apparatus Comprising Same

Application: 17/433,347 →

Publication: US 2022/0165650

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.