IP Library Assignment 058354/0977
Patent Assignment
Reel/Frame 058354/0977

Assignment of Assignor's Interest

Recorded: 2021-12-10 Pages: 5
Assignor
SKC CO., LTD.
Executed: 2021-12-02
Assignee
ABSOLICS INC.
3000 SKC DRIVE, COVINGTON, GEORGIA, 30014
Covered Properties (16)
Semiconductor Device Having a Glass Substrate Core Layer
Application: 16/296,659 →
Publication: US 2020/0286819
Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same
Application: 17/460,966 →
Publication: US 2021/0391243
Loading Cassette for Substrate Including Glass and Substrate Loading Method to Which Same Is Applied
Application: 17/433,342 →
Publication: US 2022/0048699
Packaging Glass Substrate for Semiconductor, a Packaging Substrate for Semiconductor, and a Semiconductor Apparatus
Application: 17/462,254 →
Publication: US 2021/0398891
Packaging Substrate with Core Layer and Cavity Structure and Semiconductor Device Comprising the Same
Application: 17/433,349 →
Publication: US 2022/0051972
Packaging Substrate and Method for Manufacturing Same
Application: 17/434,906 →
Publication: US 2022/0059421
Packaging Substrate, and Semiconductor Device Comprising Same
Application: 17/433,338 →
Publication: US 2022/0148942
Packaging Substrate and Semiconductor Apparatus Comprising Same
Application: 17/433,347 →
Publication: US 2022/0165650
Packaging Substrate and Semiconductor Apparatus Comprising Same
Application: 17/406,304 →
Publication: US 2021/0384131
Substrate Comprising a Lid Structure, Package Substrate Comprising the Same and Semiconductor Device
Application: 63/225,038 →
Substrate and Package Substrate Comprising the Same
Application: 63/235,847 →
Via Structure Comprising Multiple via and Substrate for Packaging Comprising the Same
Application: 63/242,625 →
Substrate Carrier and Substrate Assembly Comprising the Same
Application: 63/240,023 →
Substrate for Packaging of Device, Manufacturing Method for the Same, and Device Package Comprising the Same
Application: 63/230,118 →
Substrate for Packaging, Semiconductor Package, Preperation Method of Substrate for Packaging, and Preperation Method of Semiconductor Package
Application: 63/238,308 →
Method of Manufacturing Cleaned Substrate and Cleaned Substrate
Application: 63/242,619 →
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 24, 2019
From: KIM, SUNG JIN; RHO, YOUNG-HO; KIM, JIN CHEOL; JANG, BYUNG KYU
To: SKC CO., LTD.
Reel/Frame 049274/0617 →
Assignment of Assignor's Interest Aug 19, 2021
From: KIM, SUNGJIN; RHO, YOUNGHO; KIM, JINCHEOL; JANG, BYUNGKYU
To: SKC CO., LTD.
Reel/Frame 057228/0645 →
Assignment of Assignor's Interest Aug 24, 2021
From: KIM, SUNGJIN; RHO, YOUNGHO; KIM, JINCHEOL; JANG, BYUNGKYU
To: SKC CO., LTD.
Reel/Frame 057278/0395 →
Assignment of Assignor's Interest Aug 24, 2021
From: KIM, SUNGJIN; RHO, YOUNGHO; KIM, JINCHEOL; JANG, BYUNGKYU
To: SKC CO., LTD.
Reel/Frame 057278/0356 →
Assignment of Assignor's Interest Aug 24, 2021
From: KIM, SUNGJIN; RHO, YOUNGHO; KIM, JINCHEOL; JANG, BYUNGKYU
To: SKC CO., LTD.
Reel/Frame 057278/0409 →
Assignment of Assignor's Interest Aug 24, 2021
From: KIM, SUNGJIN; RHO, YOUNGHO; KIM, JINCHEOL; JANG, BYUNGKYU
To: SKC CO., LTD.
Reel/Frame 057278/0376 →
Assignment of Assignor's Interest Aug 30, 2021
From: RHO, YOUNGHO; KIM, SUNGJIN; KIM, JINCHEOL
To: SKC CO., LTD.
Reel/Frame 057328/0677 →
Assignment of Assignor's Interest Aug 30, 2021
From: KIM, SUNGJIN; RHO, YOUNGHO; KIM, JINCHEOL; JANG, BYUNGKYU
To: SKC CO., LTD.
Reel/Frame 057329/0053 →
Assignment of Assignor's Interest Aug 31, 2021
From: RHO, YOUNGHO; KIM, SUNGJIN; KIM, JINCHEOL
To: SKC CO., LTD.
Reel/Frame 057339/0212 →