Patent Assignment
Reel/Frame 057278/0409
Assignment of Assignor's Interest
Recorded: 2021-08-24
Pages: 3
Assignors
KIM, SUNGJIN
Executed: 2021-08-13
RHO, YOUNGHO
Executed: 2021-08-13
KIM, JINCHEOL
Executed: 2021-08-18
JANG, BYUNGKYU
Executed: 2021-08-18
Assignee
SKC CO., LTD.
84, JANGAN-RO 309BEON-GIL, JANGAN-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Packaging Substrate with Core Layer and Cavity Structure and Semiconductor Device Comprising the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.