Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
A packaging substrate includes a core layer including a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias. The plurality of core vias penetrating through the glass substrate in a thickness direction, each comprising a circular core via having a circular opening part and a non-circular core via having a 1.2 or more aspect ratio in the x-y direction of an opening part. One or more electric power transmitting elements are disposed on the non-circular core via.
1. A packaging substrate, comprising:
a core layer comprising a glass substrate with a first surface and a second surface facing each other; and
core vias respectively formed in the glass substrate and passing through the glass substrate in a thickness direction;
wherein the core vias comprise circular core vias each having a circle-shape opening part and non-circular core vias each having a 1.2 or more aspect ratio in a x-y direction of an opening part, and
wherein one or more electric power transmitting elements are disposed on each non-circular core via,
wherein the packaging substrate further comprises a non-circular via distribution pattern disposed inside each non-circular core via, and
wherein the non-circular via distribution pattern comprises:
any one or both of a filled-via pattern where all of an inner space of each non-circular core via is filled with an electrically conductive layer, and a composite-via pattern where some of the inner space of each non-circular core via is filled with an electrically conductive layer and the remainder is filled with an insulating layer.
2. The packaging substrate of claim 1 , wherein an electrically conductive layer with a minimum thickness of 5 μm or more is disposed inside each non-circular core via.
3. The packaging substrate of claim 1 , wherein an electrically conductive layer occupying 30% or more of an inner volume of each non-circular core via is disposed inside each non-circular core via.
4. The packaging substrate of claim 1 , wherein each non-circular core via comprises a shape of its opening part being oval-shape, quadrangle-shape, L-shape, or U-shape.
5. The packaging substrate of claim 1 , wherein the filled-via pattern comprises:
any one or both pattern of a filled-via pattern I where all the inner space of each non-circular core via is filled with the electrically conductive layer, and a filled-via pattern II where each non-circular core via comprises conformal-via pattern and all the inner space of each non-circular core via is filled with the electrically conductive layer.
6. The packaging substrate of claim 1 , wherein the composite-via pattern comprises:
any one or both of a composite-via pattern I where the electrically conductive layer is formed to substantially meet an inner diameter surface of each non-circular core via and the remainder inside each non-circular core via is filled with an insulating layer, and a composite-via pattern II where an insulating layer is formed to substantially meet the inner diameter surface of each non-circular core via and the electrically conductive layer is formed in a space other than the insulating layer.
7. The packaging substrate of claim 1 , wherein the electrically conductive layer of the non-circular via distribution pattern and an electrode of an electric power transmitting element are connected.
8. The packaging substrate of claim 1 , wherein each of the core vias comprises:
a first opening part in contact with the first surface;
a second opening part in contact with the second surface; and
a minimum inner diameter part having a smallest inner diameter and connecting the first opening part and the second opening part.
9. A semiconductor device, comprising:
a semiconductor element unit comprising one or more semiconductor elements;
a packaging substrate electrically connected to the semiconductor element unit; and
a motherboard electrically connected to the packaging substrate,
wherein the packaging substrate, comprising:
a core layer comprising a glass substrate with a first surface and a second surface facing each other; and
core vias respectively formed in the glass substrate and passing through the glass substrate in a thickness direction,
wherein the core vias comprise circular core vias each having a circle-shape opening part and non-circular core vias each having a 1.2 or more aspect ratio in a x-y direction of an opening part,
wherein one or more electric power transmitting elements are disposed on each non-circular core via, and
wherein the non-circular via distribution pattern comprises:
any one or both of a filled-via pattern where all of an inner space of each non-circular core via is filled with an electrically conductive layer, and a composite-via pattern where some of the inner space of each non-circular core via is filled with an electrically conductive layer and the remainder is filled with an insulating layer.
10. A packaging substrate, comprising:
a core layer comprising a glass substrate with a first surface and a second surface facing each other;
core vias respectively formed in the glass substrate and passing through the glass substrate in a thickness direction; and
wherein the core vias comprise circular core vias each having a circle-shape opening part and non-circular core vias each having a 1.2 or more aspect ratio in a x-y direction of an opening part,
wherein one or more electric power transmitting elements are disposed on each non-circular core via, and
wherein each of the core vias comprises:
a first opening part in contact with the first surface;
a second opening part in contact with the second surface; and
a minimum inner diameter part having a smallest inner diameter and connecting the first opening part and the second opening part.