Patent Assignment
Reel/Frame 057328/0677
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 3
Assignors
RHO, YOUNGHO
Executed: 2021-08-13
KIM, SUNGJIN
Executed: 2021-08-13
KIM, JINCHEOL
Executed: 2021-08-18
Assignee
SKC CO., LTD.
84, JANGAN-RO, 309BEON-GIL, JANGAN-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Packaging Substrate Having Electric Power Transmitting Elements on Non-Circular Core via of Core Vias and Semiconductor Device Comprising the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.