Packaging substrate, and semiconductor device comprising same
The embodiment relates to a packaging substrate and a semiconductor device, including an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit; and it applies a glass substrate as a core of the packaging substrate, thereby can significantly improve electrical properties such as a signal transmission rate by connecting the semiconductor element and a motherboard to be closer to each other so that electrical signals are transmitted through as short a path as possible. Therefore, it can significantly improve electrical properties such a signal transmission rate, substantially prevent generating of parasitic element, and simplify a process of treatment for an insulating layer, and thus provides a packaging substrate applicable to a high-speed circuit.
1. A packaging glass comprising:
a core layer and an upper layer,
wherein the core layer comprises a supporting substrate comprising a glass substrate with a first surface and a second surface facing each other, and comprising a core via penetrating through the first surface and the second surface; and
a core distribution layer comprising an electrically conductive layer respectively disposed on at least a part of the first surface and the second surface, and an electrically conductive layer which electrically connects them to each other through the core via;
wherein the upper layer comprises an electrically conductive layer disposed on the first surface and electrically connecting the core distribution layer and an element unit, and;
wherein an average inner diameter of a part with the minimum inner diameter within a core via formed on the glass substrate is 50 μm to 95 μm and satisfies the condition of Equation 1 below.
0.83× D 90 ≤D 50 ≤1.25× D 10 [Equation 1]
In the Equation 1, D 50 is a value corresponding to 50% in the diameter distribution of the minimum inner diameter, D 90 is a value corresponding to 90% in the diameter distribution of the minimum inner diameter, and D 10 is a value corresponding to 10% in the diameter distribution of the minimum inner diameter.
2. The packaging substrate of claim 1 ,
wherein the core via satisfies the condition of Equation 1-1 below.
0.88× D 90≤ D 50 ≤1.18× D 10 [Equation 1-1]
In the Equation 1-1, D 50 is a value corresponding to 50% in the diameter distribution of the minimum inner diameter, D 90 is a value corresponding to 90% in the diameter distribution of the minimum inner diameter, and D 10 is a value corresponding to 10% in the diameter distribution of the minimum inner diameter.
3. The packaging substrate of claim 1 ,
wherein the core via has a first surface opening part diameter which is a diameter at an opening part in contact with the first surface and a second surface opening part diameter which is a diameter at an opening part in contact with the second surface, and
a target opening part which is a larger one between the first surface opening part diameter and the second surface opening part diameter, has an average diameter of 70 μm to 120 μm and satisfies the condition of Equation 2 below.
0.9× D 90 ≤D 50 ≤1.1× D 10 [Equation 2]
In the Equation 2, D 50 is a value corresponding to 50% in the diameter distribution of a target opening part, D 90 is a value corresponding to 90% in the diameter distribution of a target opening part, and D 10 is a value corresponding to 10% in the diameter distribution of a target opening part.
4. The packaging substrate of claim 3 ,
wherein a target opening part which is a larger one between the first surface opening part diameter and the second surface opening part diameter, has an average diameter of 80 μm to 105 μm and satisfies the condition of Equation 2-1 below.
0.92× D 90 ≤D 50 ≤1.08× D 10 [Equation 2-1]
In the Equation 2-1, D 50 is a value corresponding to 50% in the diameter distribution of a target opening part, D 90 is a value corresponding to 90% in the diameter distribution of a target opening part, and D 10 is a value corresponding to 10% in the diameter distribution of a target opening part.
5. The packaging substrate of claim 1 ,
wherein the core via is disposed in the number of 100 to 3000 based on a unit area (1 cm 2 ) of the glass substrate.
6. The packaging substrate of claim 1 ,
wherein when the entire length of the core via is 100%, a part with the minimum inner diameter is disposed at the point of 40 to 60% based on the first opening part.
7. The packaging substrate of claim 1 ,
wherein the core via is disposed at the glass substrate in a pitch of 1.2 mm or less.
8. The packaging substrate of claim 1 ,
wherein the core distribution layer comprises a core distribution pattern, which is an electrically conductive layer electrically connecting the first surface and the second surface of the glass substrate through a through-via; and
a core insulating layer surrounding the core distribution pattern.
9. The packaging substrate of claim 1 ,
wherein the packaging substrate has a thickness of about 2000 μm or less.
10. A semiconductor device comprising:
a semiconductor element unit where one or more semiconductor elements are disposed; and a packaging substrate electrically connected to the semiconductor element; and a motherboard electrically connected to the packaging substrate, transmitting electrical signals of the semiconductor element and external, and connecting each other;
wherein the packaging substrate is a packaging substrate of claim 1 .