Patent Assignment
Reel/Frame 057281/0970
Assignment of Assignor's Interest
Recorded: 2021-08-25
Pages: 3
Assignor
ZHOU, WEI
Executed: 2021-08-24
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Conductive Buffer Layers for Semiconductor Die Assemblies and Associated Systems and Methods