Patent Assignment
Reel/Frame 057297/0194
Assignment of Assignor's Interest
Recorded: 2021-08-26
Pages: 4
Assignors
WANG, CHING-HUNG
Executed: 2021-02-17
LIN, YEONG-JYH
Executed: 2021-02-16
LI, CHING I
Executed: 2021-02-16
YU, TZU-WEI
Executed: 2021-02-16
YU, CHUNG-YI
Executed: 2021-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Mechanical Wafer Alignment Detection for Bonding Process