Patent Assignment
Reel/Frame 057297/0957
Assignment of Assignor's Interest
Recorded: 2021-08-26
Pages: 4
Assignors
WANG, CHIN-HUA
Executed: 2021-03-10
YEH, SHU-SHEN
Executed: 2021-03-10
LAI, PO-CHEN
Executed: 2021-03-10
LIN, PO-YAO
Executed: 2021-03-10
JENG, SHIN-PUU
Executed: 2021-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Solder Resist Structure to Mitigate Solder Bridge Risk