Patent Assignment
Reel/Frame 057299/0333
Assignment of Assignor's Interest
Recorded: 2021-08-17
Pages: 5
Assignors
CHOI, TAEJIN
Executed: 2021-05-26
LEE, CHUNGGU
Executed: 2021-05-25
PARK, SOOIN
Executed: 2021-05-25
LEE, JUNGJIN
Executed: 2021-05-26
Assignee
DOOSAN CORPORATION
275, JANGCHUNGDAN-RO, JUNG-GU, SEOUL, 04563, KOREA, REPUBLIC OF
Covered Property
(1)
Underfill Film for Semiconductor Package and Method for Manufacturing Semiconductor Package Using the Same