Patent Assignment
Reel/Frame 057305/0861
Assignment of Assignor's Interest
Recorded: 2021-08-27
Pages: 3
Assignors
CHANG, JEN-YUAN
Executed: 2021-01-26
LEE, CHIEN-CHANG
Executed: 2021-01-27
LAI, CHIA-PING
Executed: 2021-01-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Die Including Guard Ring Structure and Three-Dimensional Device Structure Including the Same