IP Library › Assignment 057306/0229
Patent Assignment
Reel/Frame 057306/0229

Assignment of Assignor's Interest

Recorded: 2021-08-27 Pages: 3
Assignors
HSIEH, FENG-CHIEN
Executed: 2021-03-16
CHENG, YUN-WEI
Executed: 2021-03-16
LEE, KUO-CHENG
Executed: 2021-03-16
WU, CHENG-MING
Executed: 2021-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Semiconductor Arrangement with Isolation Structure
Application: 17/458,720 →
Publication: US 2023/0068723