Patent Assignment
Reel/Frame 057308/0601
Assignment of Assignor's Interest
Recorded: 2021-08-27
Pages: 3
Assignors
HSU, CHIA-WEI
Executed: 2020-12-27
CHEN, BO-TING
Executed: 2021-01-03
LEE, JAM-WEM
Executed: 2020-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit and Method of Manufacturing Same