Patent Assignment
Reel/Frame 057316/0037
Assignment of Assignor's Interest
Recorded: 2021-08-27
Pages: 3
Assignors
TSAI, MING CHIAN
Executed: 2021-06-02
PENG, SHIH-WEI
Executed: 2021-06-02
LIN, WEI-CHENG
Executed: 2021-06-03
TZENG, JIANN-TYNG
Executed: 2021-06-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuits and Methods for Power Delivery