Patent Assignment
Reel/Frame 057319/0921
Assignment of Assignor's Interest
Recorded: 2021-08-28
Pages: 3
Assignors
CHANG, JEN-YUAN
Executed: 2021-02-13
LAI, CHIA-PING
Executed: 2021-01-20
LEE, CHIEN-CHANG
Executed: 2021-01-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Three-Dimensional Integrated Circuit