Patent Assignment
Reel/Frame 057324/0092
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
LIAO, YI-BO
Executed: 2021-06-20
HUANG, YU-XUAN
Executed: 2021-06-20
CHEN, HOU-YU
Executed: 2021-06-20
CHENG, KUAN-LUN
Executed: 2021-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices with Front Side to Backside Conductive Paths and Methods of Fabrication Thereof