Patent Assignment
Reel/Frame 057324/0594
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2021-08-09
LIN, HSIN FU
Executed: 2021-08-09
LIU, CHIEN HUNG
Executed: 2021-08-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
An Integrated Chip (Ic) Having Conductive Tsv Extended Through Soi Substrate Comprising a Semiconductor Device Layer, an Insulating Layer and a Metal Layer