Patent Assignment
Reel/Frame 057325/0324
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
WANG, SHENG-CHEN
Executed: 2021-02-02
LEE, KAI-HSUAN
Executed: 2021-02-03
YEONG, SAI-HOOI
Executed: 2021-02-02
CHUI, CHI ON
Executed: 2021-02-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Air Gaps in Memory Array Structures