Patent Assignment
Reel/Frame 057325/0362
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 12
Assignors
ZHAO, CHONG J.
Executed: 2021-08-02
TOMISHIMA, SHIGEKI
Executed: 2021-07-29
BAINS, KULJIT S.
Executed: 2021-07-29
MCCALL, JAMES A.
Executed: 2021-08-09
ZIAKAS, DIMITRIOS
Executed: 2021-08-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Stacked Memory Chip Solution with Reduced Package Inputs/Outputs (I/Os)