Patent Assignment
Reel/Frame 057325/0903
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
HUANG, CHIH-FAN
Executed: 2021-02-25
TU, WEN-CHIUNG
Executed: 2021-03-14
WANG, LIANG-WEI
Executed: 2021-02-26
CHEN, DIAN-HAU
Executed: 2021-02-26
CHEN, YEN-MING
Executed: 2021-02-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Method for MRAM Devices