Patent Assignment
Reel/Frame 057326/0628
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 4
Assignors
WANG, CHIN-HUA
Executed: 2021-06-10
YEH, SHU-SHEN
Executed: 2021-05-26
LAI, PO-CHEN
Executed: 2021-05-26
LIN, PO-YAO
Executed: 2021-05-26
JENG, SHIN-PUU
Executed: 2021-05-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structures and Method for Forming the Same