Patent Assignment
Reel/Frame 057331/0236
Assignment of Assignor's Interest
Recorded: 2021-08-30
Pages: 3
Assignors
LIN, HSIAO-CHIEN
Executed: 2021-03-08
CHEN, HSI CHUNG
Executed: 2021-03-24
TSAI, CHENG-HUNG
Executed: 2021-03-09
LIN, CHIH-HSUAN
Executed: 2021-03-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Forming Method Thereof