Patent Assignment
Reel/Frame 057339/0299
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 3
Assignors
SU, CHIA-WEI
Executed: 2021-02-22
WU, CHIA-TIEN
Executed: 2021-03-01
CHEN, HSIN-PING
Executed: 2021-03-15
SHUE, SHAU-LIN
Executed: 2021-02-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same