Patent Assignment
Reel/Frame 057342/0380
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 3
Assignors
WEI, HUI-HSIEN
Executed: 2020-12-22
HO, YEN-CHUNG
Executed: 2020-11-26
YU, CHIA-JUNG
Executed: 2020-11-26
WU, YONG-JIE
Executed: 2020-11-26
HSU, PIN-CHENG
Executed: 2020-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device, Integrated Circuit and Method of Manufacturing the Same