Patent Assignment
Reel/Frame 057342/0619
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 3
Assignee
TAIYO YUDEN CO., LTD.
7-19 KYOBASHI 2-CHOME, CHUO-KU,, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Acoustic Wave Device and Wafer with Support Substrate Having an Uneven Surface, and Manufacturing Method of Wafer