Patent Assignment
Reel/Frame 057343/0320
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 4
Assignors
PAO, CHIA-HAO
Executed: 2021-01-04
YANG, CHIH-CHUAN
Executed: 2021-01-04
CHEN, CHIH-HSUAN
Executed: 2021-01-04
LIN, SHIH-HAO
Executed: 2021-01-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure with a Reduced Amount of Defects and Methods for Fabricating the Same