Patent Assignment
Reel/Frame 057346/0322
Assignment of Assignor's Interest
Recorded: 2021-08-31
Pages: 4
Assignors
LAI, PO-CHEN
Executed: 2021-03-01
YEW, MING-CHIH
Executed: 2021-03-01
LIN, PO-YAO
Executed: 2021-02-26
LIN, YU-SHENG
Executed: 2021-02-26
JENG, SHIN-PUU
Executed: 2021-02-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package with Reinforcing Structures