Patent Assignment
Reel/Frame 057357/0109
Assignment of Assignor's Interest
Recorded: 2021-09-01
Pages: 6
Assignors
KANG, HYEONGMUN
Executed: 2021-08-30
KIM, TAEHYEONG
Executed: 2021-08-30
LEE, WOODONG
Executed: 2021-08-30
CHOI, HWANYOUNG
Executed: 2021-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Dummy Chip