Patent Assignment
Reel/Frame 057376/0419
Assignment of Assignor's Interest
Recorded: 2021-09-02
Pages: 10
Assignors
MICOVIC, MIROSLAV
Executed: 2021-08-30
BAKER, KAREN KANEKO
Executed: 2021-08-30
CARBONNEAU, CHRISTOPHER
Executed: 2021-08-30
HERRICK, KATHERINE J.
Executed: 2021-09-01
CLEMENT, TERESA J.
Executed: 2021-08-31
LAROCHE, JEFFREY R.
Executed: 2021-09-01
Assignee
RAYTHEON COMPANY
870 WINTER STREET, WALTHAM, MASSACHUSETTS, 02451-1449
Covered Property
(1)
Wafer-Scale Direct Bonded Array Core Block for an Active Electronically Steerable Array (Aesa)