IP Library › Assignment 057376/0569
Patent Assignment
Reel/Frame 057376/0569

Assignment of Assignor's Interest

Recorded: 2021-09-02 Pages: 4
Assignors
LEE, JE HEE
Executed: 2021-08-01
BAIK, SEUNG IN
Executed: 2021-07-30
HONG, JI SU
Executed: 2021-07-30
JANG, EUN HA
Executed: 2021-07-30
KIM, HYOUNG UK
Executed: 2021-07-30
PARK, JAE SUNG
Executed: 2021-08-02
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Capacitor Having Improved Reliability by Adjusting Grain Size of Dielectric Layer
Application: 17/465,176 →
Publication: US 2022/0139625