Patent Assignment
Reel/Frame 057377/0764
Assignment of Assignor's Interest
Recorded: 2021-09-02
Pages: 6
Assignors
TSENG, CHIEN-YUAN
Executed: 2021-08-31
WANG, MENG-JEN
Executed: 2021-08-31
CHANG, CHEN-TSUNG
Executed: 2021-08-31
WANG, CHIH-FANG
Executed: 2021-08-31
CHEN, CHIEN-HAO
Executed: 2021-08-31
TSAO, AN-CHI
Executed: 2021-08-31
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same