Patent Assignment
Reel/Frame 057378/0357
Assignment of Assignor's Interest
Recorded: 2021-09-03
Pages: 6
Assignors
YANG, CHE-CHIA
Executed: 2021-03-19
YEH, SHU-SHEN
Executed: 2021-03-10
LIAO, LI-LING
Executed: 2021-03-21
WANG, CHIN-HUA
Executed: 2021-03-11
LIN, PO-YAO
Executed: 2021-03-10
JENG, SHIN-PUU
Executed: 2021-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Stiffener Ring Having Slant Sidewall
Application:
17/458,568 →
Publication:
US 2023/0063295