IP Library Assignment 057387/0828
Patent Assignment
Reel/Frame 057387/0828

Change of Name

Recorded: 2021-09-04 Pages: 10
Assignor
LINEAR TECHNOLOGY LLC
Executed: 2018-11-05
Assignee
ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
BAY F1 RAHEEN INDUSTRIAL ESTATE, CO. LIMERICK, LIMERICK, IRELAND
Covered Properties (2)
Exposed, Solderable Heat Spreader for Integrated Circuit Packages
Patent: 9,431,319 →
Application: 14/630,239 →
Publication: US 2016/0035644
Exposed Backside Heat-Spreader for Embedded Die Package
Application: 62/032,347 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 24, 2015
From: OLSEN, EDWARD WILLIAM; SHTARGOT, LEONARD; NG, DAVID ROY; WITT, JEFFREY KINGAN
To: LINEAR TECHNOLOGY CORPORATION
Reel/Frame 035019/0782 →
Change of Name Aug 23, 2018
From: LINEAR TECHNOLOGY CORPORATION
To: LINEAR TECHNOLOGY LLC
Reel/Frame 046922/0727 →