Exposed, solderable heat spreader for integrated circuit packages

1. An integrated circuit package comprising:

a semiconductor die that contains an electronic circuit and exposed electrical connections to the electronic circuit;

a thermally-conductive heat spreader having a first outer surface and a second outer surface substantially parallel to the first outer surface, the first outer surface being affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner; and

non-electrically conductive, encapsulation material completely encapsulating the semiconductor die and the heat spreader, except for the second outer surface of the heat spreader which is solderable and forms part of an exterior surface of the integrated circuit package,

wherein:

the integrated circuit package is an embedded die package;

the semiconductor die is an embedded die;

the semiconductor die includes a circuit side that is substantially parallel to the silicon side;

the integrated circuit package further includes at least one electroplated electrical connection to the circuit side of the semiconductor die; and

the at least one electroplated electrical connection is electrically connected entirely through an electroplated or sputtered conductive routing layer to a terminal in the exterior surface of the integrated circuit package that includes the second outer surface of the heat spreader, the terminal including a leadframe terminal exposed from the encapsulation material at a portion of the exterior surface of the integrated circuit package and a portion of sidewalls of the integrated circuit package.

2. The integrated circuit package of claim 1 wherein the first outer surface of the heat spreader is affixed to the silicon side of the semiconductor die using an adhesive.

3. The integrated circuit package of claim 1 wherein the heat spreader is electrically conductive and is electrically connected to the silicon side of the semiconductor die.

4. The integrated circuit package of claim 1 further comprising at least one additional electrical component that is not part of the semiconductor die.

5. The integrated circuit package of claim 1 further comprising a second thermally-conductive, solderable heat spreader attached to an additional electrical component and having a surface that forms part of an exterior surface of the integrated circuit package.

6. The integrated circuit package of claim 1 wherein the first outer surface of the heat spreader has a larger surface area than that of the silicon side of the semiconductor die.

7. The integrated circuit package of claim 1 wherein the integrated circuit package has a configuration that makes it suitable to solder the second outer surface of the heat spreader to a surface of a circuit board on which the integrate circuit package is mounted.

8. The integrated circuit package of claim 1 wherein the first outer surface of the heat spreader is plated to the silicon side of the semiconductor die.

9. The integrated circuit package of claim 1 wherein the first outer surface of the heat spreader is electroplated to the silicon side of the semiconductor die.

10. The integrated circuit package of claim 1 wherein the first outer surface of the heat spreader is electroless plated to the silicon side of the semiconductor die.

11. The integrated circuit package of claim 1 wherein the at least one electroplated electrical connection is electrically connected to a terminal in an exterior surface of the integrated circuit package, other than the exterior surface that includes the second surface of the heat spreader.

12. The integrated circuit package of claim 11 wherein the surface containing the terminal is substantially parallel to the exterior surface that includes the second surface of the heat spreader.

13. The integrated circuit package of claim 1 wherein the integrated circuit package has a configuration that makes it suitable to solder the second outer surface of the heat spreader to a surface of a circuit board on which the integrate circuit package is mounted.

14. The integrated circuit package of claim 1 wherein the semiconductor die includes through-silicon vias.

15. The integrated circuit package of claim 1 further comprising one or more additional semiconductor dies and heat spreaders stacked vertically.

16. An integrated circuit package comprising:

a semiconductor die that contains an electronic circuit and exposed electrical connections to the electronic circuit;

a thermally-conductive heat spreader having a first outer surface and a second outer surface distinct from the first outer surface, the first outer surface being affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner; and

non-electrically conductive, encapsulation material completely encapsulating the semiconductor die and the heat spreader, except for the second outer surface of the heat spreader which is solderable and forms part of an exterior surface of the integrated circuit package,

wherein:

the integrated circuit package is an embedded die package;

the semiconductor die is an embedded die;

the semiconductor die includes a circuit side that is substantially parallel to the silicon side;

the integrated circuit package further includes at least one electroplated electrical connection to the circuit side of the semiconductor die; and

the at least one electroplated electrical connection is electrically connected entirely through an electroplated or sputtered conductive routing layer to a terminal in the exterior surface of the integrated circuit package that includes the outer second surface of the heat spreader, the terminal including a leadframe terminal exposed from the encapsulation material at a portion of the exterior surface of the integrated circuit package and a portion of sidewalls of the integrated circuit package.