Patent Assignment
Reel/Frame 057388/0294
Assignment of Assignor's Interest
Recorded: 2021-09-05
Pages: 5
Assignors
YU, CHI-YANG
Executed: 2021-08-10
WU, NIEN-FANG
Executed: 2021-08-13
CHEN, HAI-MING
Executed: 2021-08-23
LIANG, YU-MIN
Executed: 2021-08-13
WU, JIUN-YI
Executed: 2021-08-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Manufacturing Method Thereof