Patent Assignment
Reel/Frame 057401/0958
Assignment of Assignor's Interest
Recorded: 2021-09-07
Pages: 2
Assignor
SHIH, SHING-YIH
Executed: 2021-08-17
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Preparing the Same