Patent Assignment
Reel/Frame 057402/0992
Assignment of Assignor's Interest
Recorded: 2021-09-07
Pages: 4
Assignors
LEE, HUNTEAK
Executed: 2021-09-07
KIM, GWANG
Executed: 2021-09-07
YE, JUNHO
Executed: 2021-09-06
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Double-Sided Partial Molded SIP Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.