Patent Assignment
Reel/Frame 057409/0206
Assignment of Assignor's Interest
Recorded: 2021-09-08
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Defect Prediction Device and Operating Method Thereof