IP Library › Assignment 057429/0817
Patent Assignment
Reel/Frame 057429/0817

Assignment of Assignor's Interest

Recorded: 2021-09-09 Pages: 3
Assignors
BANDO, RYUJIRO
Executed: 2021-06-15
IKEI, HITOSHI
Executed: 2021-03-22
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Package and Semiconductor Device
Application: 17/200,411 →
Publication: US 2021/0296256