Patent Assignment
Reel/Frame 057443/0831
Assignment of Assignor's Interest
Recorded: 2021-09-10
Pages: 14
Assignors
EID, FERAS
Executed: 2021-09-07
ELSHERBINI, ADEL
Executed: 2021-08-18
SWAN, JOHANNA
Executed: 2021-09-09
LIFF, SHAWNA
Executed: 2021-09-09
ALEKSOV, ALEKSANDAR
Executed: 2021-08-24
SEBOT, JULIEN
Executed: 2021-08-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Thermal Performance in Hybrid Bonded 3D Die Stacks