Patent Assignment
Reel/Frame 057450/0796
Assignment of Assignor's Interest
Recorded: 2021-09-10
Pages: 4
Assignors
CHANG, JEN-YUAN
Executed: 2021-06-21
LAI, CHIA-PING
Executed: 2021-06-21
CHEN, SHIH-CHANG
Executed: 2021-06-21
TSAI, TZU-CHUNG
Executed: 2021-06-21
LEE, CHIEN-CHANG
Executed: 2021-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Die Including Through Substrate via Barrier Structure and Methods for Forming the Same