Patent Assignment
Reel/Frame 057456/0151
Assignment of Assignor's Interest
Recorded: 2021-09-12
Pages: 5
Assignors
TSAI, HAO-YI
Executed: 2021-05-06
HSIEH, CHENG-CHIEH
Executed: 2021-05-04
CHIANG, TSUNG-HSIEN
Executed: 2021-05-13
CHIANG, HUI-CHUN
Executed: 2021-05-14
HUANG, TZU-SUNG
Executed: 2021-05-11
TSENG, MING-HUNG
Executed: 2021-05-13
CHUANG, KRIS LIPU
Executed: 2021-05-05
WENG, CHUNG-MING
Executed: 2021-05-04
YU, TSUNG-YUAN
Executed: 2021-05-04
LIU, TZUAN-HORNG
Executed: 2021-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same