Patent Assignment
Reel/Frame 057456/0253
Assignment of Assignor's Interest
Recorded: 2021-09-12
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2021-05-27
KUO, YIAN-LIANG
Executed: 2021-05-27
YEE, KUO-CHUNG
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Thermal Dissipation Structure Therein and Manufacturing Method Thereof