Patent Assignment
Reel/Frame 057456/0312
Assignment of Assignor's Interest
Recorded: 2021-09-12
Pages: 6
Assignors
YEH, SHU-SHEN
Executed: 2020-12-06
YANG, CHE-CHIA
Executed: 2020-12-16
WANG, CHIN-HUA
Executed: 2020-12-06
LIN, YU-SHENG
Executed: 2020-12-06
LIN, PO-YAO
Executed: 2020-12-06
JENG, SHIN-PUU
Executed: 2020-12-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof