Patent Assignment
Reel/Frame 057469/0205
Assignment of Assignor's Interest
Recorded: 2021-09-13
Pages: 3
Assignors
HSU, HUNGEN
Executed: 2020-12-23
SHEN, WEI-TIEN
Executed: 2020-12-22
HSU, KUO-CHING
Executed: 2020-12-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Substrate, Package Using the Same, and Method of Manufacturing the Same