IP Library Assignment 057469/0705
Patent Assignment
Reel/Frame 057469/0705

Assignment of Assignor's Interest

Recorded: 2021-09-14 Pages: 3
Assignors
FANG, YU-JING
Executed: 2021-09-08
HSU, HSIANG-CHUN
Executed: 2021-09-08
CHANG, CHENG-PING
Executed: 2021-09-08
Assignee
LEXTAR ELECTRONICS CORPORATION
NO.3, GONGYE E. 3RD RD., HSINCHU SCIENCE PARK, HSINCHU, 30075, TAIWAN
Covered Property (1)
Diode Package Structure and Manufacturing Method Thereof
Application: 17/447,574 →
Publication: US 2022/0190216
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →