Patent Assignment
Reel/Frame 075286/0822
Merger
Recorded: 2026-03-27
Pages: 47
Assignor
LEXTAR ELECTRONICS CORPORATION
Executed: 2026-01-19
Assignee
ENNOSTAR CORPORATION
NO. 21, LI-HSIN RD, HSINCHU SCIENCE PARK, HSINCHU CITY, 300, TAIWAN
Covered Properties
(343)
Optical Structure
Application:
18/811,463 →
Publication:
US US20250120230A1
Light-Emitting Module and Lamp Panel Structure Including the Same
Application:
19/178,657 →
Publication:
US US20260153224A1
Light-Emitting Unit and Light-Emitting Device Including the Same
Application:
19/195,340 →
Publication:
US US20250366276A1
Micro Light-Emitting Diode Package
Application:
18/747,368 →
Publication:
US US20250022854A1
Micro Light-Emitting Diode Package Structure
Application:
18/826,668 →
Publication:
US US20250143042A1
Optical Module
Application:
18/938,136 →
Publication:
US US20250155609A1
Optical Structure
Patent:
12,152,771 →
Application:
18/424,209 →
Light-Emitting Structure and Light-Emitting Module
Application:
18/942,007 →
Publication:
US US20250176333A1
Display Device, Light-Emitting Module Thereof and Driving Method Thereof
Application:
19/236,635 →
Publication:
US US20250384826A1
Light-Emitting Diode Module
Application:
19/000,903 →
Publication:
US US20250234695A1
Hybrid Encapsulation Film and Method of Manufacturing Light-Emitting Device Using the Same
Application:
19/070,335 →
Publication:
US US20250331354A1
Package Structure
Application:
18/777,486 →
Publication:
US US20250098384A1
Light-Emitting Device and Display Device Including the Same
Laser Transfer Structure and Laser Transfer Method
Application:
18/675,527 →
Publication:
US US20250372416A1
Optical Substrate, Display Device and Preparation Method of Display Device
Application:
19/240,813 →
Publication:
US US20250393378A1
Led Chip Configuration Method
Application:
19/324,680 →
Publication:
US US20260076004A1
Light-Emitting Diode Package
Application:
19/264,543 →
Publication:
US US20260020417A1
Light-Emitting Device
Application:
19/033,051 →
Publication:
US US20250255048A1
Optoelectronic Device
Application:
19/008,351 →
Publication:
US US20250255080A1
Optoelectronic Semiconductor Components
Application:
19/189,088 →
Publication:
US US20250393372A1
Packaging Structure and Formation Method Thereof
Application:
19/191,985 →
Publication:
US US20250366294A1
Semiconductor Component and Semiconductor Device
Application:
19/189,091 →
Publication:
US US20250366283A1
Light-Emitting Diode Device
Application:
19/193,833 →
Publication:
US US20260082464A1
Semiconductor Element
Application:
19/242,496 →
Publication:
US US20250386645A1
Semiconductor Structure
Application:
19/259,574 →
Publication:
US US20260013310A1
Semiconductor Structure, Semiconductor Unit, and Formation Method Thereof
Application:
19/268,741 →
Publication:
US US20260020420A1
Semiconductor Device
Application:
19/420,394 →
Publication:
US US20260173624A1
Package Structure
Application:
19/371,554 →
Publication:
US US20260123130A1
Package Structure
Application:
19/366,747 →
Publication:
US US20260123152A1
Package Structure
Application:
19/365,671 →
Publication:
US US20260123163A1
Package Structure
Application:
19/187,776 →
Publication:
US US20250359403A1
Light-Emitting Diode Package
Application:
19/404,560 →
Publication:
US US20260164865A1
Light Source Module
Pixel Unit Having a Plurality of Green Led Elements and Display Module
Micro Light-Emitting Diode Pixel Structure and Method for Forming the Same
Application:
18/498,743 →
Publication:
US US20240313180A1
Detection Element and a Wearable Device of Biological Subcutaneous Feature Including the Same
Application:
18/610,147 →
Publication:
US US20240315615A1
Light Source Module and Manufacturing Method Thereof
Application:
18/939,166 →
Publication:
US US20250160079A1
Micro Light-Emitting Package
Laser Module
Application:
18/935,144 →
Publication:
US US20250149851A1
Display Device and Led Driving Device Thereof
Application:
18/891,882 →
Publication:
US US20250182679A1
Light-Emitting Device and Display Device Including the Same
Application:
18/936,706 →
Publication:
US US20250169249A1
Light-Emitting Element, Manufacturing Method Thereof, and Package Structure Comprising the Same
Application:
18/669,141 →
Publication:
US US20240395986A1
Light-Conversion Material and Light-Emitting Device and Display Device Including the Same
Application:
18/517,401 →
Publication:
US US20240363810A1
Micro Light-Emitting Diode Package Structure and Forming Method Thereof
Application:
18/633,418 →
Publication:
US US20240355986A1
Wafer with Micro Integrated Circuits
Application:
18/733,292 →
Publication:
US US20240413133A1
Driving Device and Electronic Device
Semiconductor Structure and Method of Forming the Same
Application:
18/637,388 →
Publication:
US US20240379908A1
Light-Modulating Unit and Display Device Using the Same
Lens
Patent:
1,122,318 →
Application:
29/927,481 →
Lens Structure
Application:
19/260,338 →
Publication:
US US20260009932A1
Light-Emitting Diode Display Device
Application:
18/761,831 →
Publication:
US US20250015059A1
Light-Emitting Device and Method for Manufacturing the Same
Application:
18/675,511 →
Publication:
US US20240405168A1
Wavelength Conversion Device and Manufacturing Method Thereof
Application:
19/256,972 →
Publication:
US US20260013304A1
Method for Fabricating Led Chip Comprising Reduced Mask Count and Lift-Off Processing
Light-Emitting Member and Its Forming Mold
Light-Emitting Diode Package Structure, Cold Cathode Flourescent Lamp and Photoluminescent Material Thereof
Light Emitting Diode
Led & Led-Applied Backlight Module
Light-Emitting Diode Package Structure
High-Powered Diode Holder and a Package Thereof
Smd Diode Holding Structure and Package Thereof
Surface Mount Type Light-Emitting Element Package Device with High Extraction Efficiency Due to Gradually Varying Index of Refraction and Anti-Reflective Top Layer
Casting for an Led Module
Light Emitting Diode and Wavelength Converting Material
Package Structure
Light Source Having Led and Frame Structure
Light Emitting Diode Package
Package Substrate and Light Emitting Device Using the Same
Fabrication Method of Light Emitting Diode
Light Emission Diode
Illuminating Device
Casting for an Led Module
Method for Fabricating Led Chip Comprising Reduced Mask Count and Lift-Off Processing
Method for Fabricating Led Chip Comprising Reduced Mask Count and Lift-Off Processing
Method for Fabricating Led Chip Comprising Reduced Mask Count and Lift-Off Processing
Method for Fabricating Led Chip Comprising Reduced Mask Count and Lift-Off Processing
Method for Fabricating Led Chip Comprising Reduced Mask Count and Lift-Off Processing
Smd Diode Holding Structure and Package Thereof
Method for Fabricating Led Chip Comprising Reduced Mask Count
Light Emitting Diode Lead-Frame
Patent:
664,105 →
Application:
29/398,400 →
Light Emitting Diode
Patent:
664,104 →
Application:
29/398,366 →
Light Emitting Diode Package
Patent:
664,505 →
Application:
29/398,010 →
Light Emitting Diode Lead-Frame
Patent:
664,109 →
Application:
29/402,484 →
Light Emitting Diode Package
Patent:
664,107 →
Application:
29/402,468 →
Light Emitting Diode Lead-Frame
Patent:
664,108 →
Application:
29/402,479 →
Light Emitting Diode Package
Patent:
664,510 →
Application:
29/402,453 →
Light Emitting Diode Lead-Frame
Patent:
667,384 →
Application:
29/406,686 →
Light Emitting Diode Lead-Frame
Patent:
667,385 →
Application:
29/406,977 →
Light Emitting Diode Package
Patent:
668,623 →
Application:
29/406,960 →
Light Emitting Diode Lead-Frame
Patent:
669,044 →
Application:
29/407,166 →
Light Emitting Diode Package
Patent:
668,624 →
Application:
29/406,971 →
Light Emitting Diode Package
Patent:
668,235 →
Application:
29/406,690 →
Led Chip
Patent:
668,234 →
Application:
29/406,549 →
Light Emitting Element
Led Chip
Patent:
669,869 →
Application:
29/406,563 →
Light Emitting Diode Lead-Frame
Patent:
670,661 →
Application:
29/406,802 →
Light Emitting Diode Package
Patent:
670,662 →
Application:
29/406,916 →
Light Emitting Diode Package
Patent:
671,082 →
Application:
29/406,829 →
Lamp
Patent:
671,237 →
Application:
29/416,481 →
Light Emitting Diode Lead-Frame
Patent:
670,663 →
Application:
29/408,561 →
Multi-Chip Led
Patent:
675,169 →
Application:
29/408,511 →
Light Emitting Diode Lead-Frame
Patent:
675,170 →
Application:
29/408,562 →
Lens for Light Emitting Diode (Led)
Patent:
679,857 →
Application:
29/403,640 →
Light Emitting Diode Package
Patent:
678,226 →
Application:
29/410,509 →
Light Emitting Diode Package
Patent:
678,225 →
Application:
29/408,556 →
Light Emitting Diode Lead-Frame
Patent:
679,666 →
Application:
29/410,603 →
LED Chip
Patent:
680,975 →
Application:
29/406,557 →
Led Chip
Patent:
680,976 →
Application:
29/406,576 →
Downlight
Patent:
681,863 →
Application:
29/420,395 →
Light Emitting Diode
Light-Emitting Diode Package Including a Cavity with a Plurality of Side-Walls with Different Inclinations
Lamp
Patent:
687,984 →
Application:
29/430,815 →
Light Emitting Diode Module
Patent:
687,788 →
Application:
29/425,804 →
Light Emitting Diode Module
Patent:
687,789 →
Application:
29/430,821 →
Light Emitting Diode Package
Patent:
693,780 →
Application:
29/433,279 →
Light Emitting Diode Package
Patent:
695,239 →
Application:
29/438,204 →
Light-Emitting Diode Lamp with an Improved Leadframe
Light Emitting Diode Package
Patent:
697,879 →
Application:
29/455,094 →
Light Emitting Diode Lead-Frame
Patent:
697,878 →
Application:
29/455,066 →
Light Emitting Diode Package
Patent:
697,877 →
Application:
29/454,543 →
Light Emitting Diode Lead-Frame
Patent:
697,876 →
Application:
29/454,484 →
Light Emitting Diode Array
Semiconductor Light Emitting Structure
Low Contact Resistance Semiconductor Structure and Method of Fabricating the Same
Light Emitted Diode
Light Emitting Diode Package Structure
Light-Emitting Diode Package
Light Emitting Diode Package
Patent:
709,042 →
Application:
29/456,957 →
Light Emitting Diode Package
Patent:
709,041 →
Application:
29/456,119 →
Light Emitting Diode Package
Patent:
709,039 →
Application:
29/432,065 →
Light Emitting Diode Package
Patent:
709,040 →
Application:
29/438,300 →
Light Bar Assembly
Light Source Module Having Leds
Light Emitting Diode Package
Patent:
712,851 →
Application:
29/456,955 →
Carrier Structure and Manufacturing Method Thereof
Downlight
Patent:
715,971 →
Application:
29/420,396 →
Flip-Chip Light-Emitting Diode Structure and Manufacturing Method Thereof
Light Emitting Diode Lead-Frame
Patent:
719,111 →
Application:
29/472,847 →
Light-Emitting Diode Package
Patent:
718,726 →
Application:
29/472,846 →
Light Emitting Diode and Method for Manufacturing the Same
Semiconductor Light Emitting Structure
Light-Emitting Diode Package
Patent:
728,492 →
Application:
29/479,907 →
Light-Emitting Diode Lead-Frame
Patent:
728,493 →
Application:
29/479,909 →
Light-Emitting Diode
Solid-State Light Emitting Module
Patent:
9,018,670 →
Application:
14/305,006 →
High Illumination Efficiency Light Emitting Diode
Method for Fabricating Light-Emitting Diode Device
Lead-Frame
Patent:
730,848 →
Application:
29/496,032 →
Led Drive Circuit
Light-Emitting Diode with Side-Wall Bump Structure and Mounting Structure Having the Same
Control Method of Lamp
Light Emitting Diode Module
Light Emitting Diode Package Structure
Light-Emitting Diode Package and Method for Manufacturing the Same
Illuminating Device
Light Emitting Diode and Method for Manufacturing the Same
Electrode Structure and Light Emitting Diode Structure Having the Same
Light-Emitting Diode Chip
Light-Emitting Diode and Method for Manufacturing Thereof
Light Emitting Diode and Method of Fabricating the Same
Light Emitting Diode Substrate
Light-Emitting Diode Device and Method for Fabricating the Same
Light-Emitting Assembly and Method for Manufacturing the Same
Light Emitting Diode Structure
Comprehensive Light-Emitting Diode Device and Lighting-Module
Light Emitting Diode Structure
Semiconductor Chip Structure
Eutectic Solder Structure for Chip
Light-Emitting Device Package and Method for Manufacturing the Same
Integrated Wireless and Wired Light Control System
Lighting Apparatus, Led Mounting Substrate and Mold for Manufacturing the Same
Light-Emitting Diode Chip
Light-Emitting Diode Chip
Led Device and Led Lamp Using the Same
Light Emitting Chip and Light Emitting Device Having the Same
Light-Emitting Device
Electrode Structure and Light Emitting Diode Using the Same
Light Emitting Diode Structure and Light Emitting Diode Module
Patent:
9,252,332 →
Application:
14/706,266 →
Light-Emitting Diode and Method for Manufacturing the Same
Light Emitting Diode and Method of Fabricating the Same
Led Packaging Structure and Method for Manufacturing the Same
Light-Emitting Diodes
Optical Lens
Patent:
765,753 →
Application:
29/542,783 →
Optical Lens
Patent:
765,752 →
Application:
29/542,707 →
LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
Lamp Tube
Light Emitting Diode Structure
Lens Device and Light Source Module Using the Same
Heat Sink for Electrical Elements and Light-Emitting Device Containing Thereof
Led Display and Manufacturing Method Thereof
Led Display and Manufacturing Method Thereof
Ceiling Light
Patent:
770,077 →
Application:
29/544,753 →
Light Bar Structure
Lead Frame for Light-Emitting Diode
Patent:
782,425 →
Application:
29/497,491 →
Light-Emitting Diode Chip
Light-Emitting Diode Chip Package
Light-Emitting Diode
Led Device and Dimming System and Method Thereof
Lighting Apparatus and Wavelength Converting Apparatus Thereof
Light-Emitting Element and Light-Emitting Device Containing the Same
Light-Emitting Device
Led Chip Package
Led Display and Manufacturing Method Thereof
Light Emitting Diode Package
Dimming Module, Solid State Lighting Device, and Dimming Method
Dimming Module and Solid State Lighting Device
Fluoride Phosphor, Fabricating Method Thereof, and Light-Emitting Apparatus and Backlight Module Employing the Same
Flip-Chip Light Emitting Diode Chip
Light Source Module
Epitaxial Structure with Air Voids in Shape of Trapezoid
Lighting Apparatus and Lens Structure Thereof
Light-Guiding Pillar and Vehicle Lamp using the Same
Light-Emitting Diode Device
Light Emitting Structure, Light Device and Backlight Module
Vehicle Lamp with Complex Lightguide
Light Emitting Diode Vehicle Headlight
Light-Emitting Diode Module and Lamp Using the Same
Phosphor with Preferred Orientation, Fabricating Method Thereof, and Light-Emitting Element Package Structure Employing the Same
Light Emitting Diode Headlight
Phosphor, Fabricating Method Thereof, and Light-Emitting Device and Backlight Module Employing the Same
Semiconductor Light-Emitting Structure with Metal Layer and Distributed Bragg Reflector and Semiconductor Package Structure Thereof
Light-Emitting Diode Chip
Fluoride Phosphor Including Sheet-Like Crystal and Manufacturing Method and Application Thereof
Light Emitting Diode Chip Scale Packaging Structure
Lighting System
Dimming Module, Dimming Method and Lighting Device
Side-View Light Emitting Laser Element
Compound Semiconductor Film Structure
Led Package Structure
Light-Emitting Diode Chip
Vehicle Lamp with Segmented Ellipsoidal Reflector, Condenser Lens, and Plurality of Light Sources Mounted on Different Planes of Heat Dissipating Base
Lens Array, Vehicle-Lamp Lens Group Using Lens Array, and Vehicle-Lamp Assembly Using Vehicle-Lamp Lens Group
Light Emitting Diode Chip Scale Packaging Structure and Direct Type Backlight Module
White Light Source Device
Phosphor, Fabricating Method Thereof, Method for Regulating Crystal Phase Thereof, and Method for Changing Crystal Phase Thereof
Light-Enhancement Device, and Appliance Having the Same
Quantum Dot Composite Material and Manufacturing Method and Application Thereof
Frame, Light-Emitting Device Using the Same, and Method for Manufacturing the Same
Wavelength-Converting Film and Light Emitting Device and Display Device Using the Same
Light-Emitting Diode Chip
Micro Light Emitting Diode Structure and Method for Manufacturing Micro Light Emitting Diode
Light Emitting Device and Backlight Module
Display Device Having Multiple Pixels in a Substrate Groove
Light Emitting Diode Structure
Light-Emitting Diode Device and Manufacturing Method Thereof
Light Emitting Diode Device and Manufacturing Method Thereof
Pwm Filter Circuit and Related Control System
Light-Emitting Diode Package
Light Bar
Patent:
898,268 →
Application:
29/679,034 →
Led Carrier and Led Package Having the Same
Display Device
Infrared Emitting Fluoride Phosphor and Infrared Light Emitting Device
Perovskite Luminescent Nanocrystal, Light Emitting Device, and Manufacturing Method for Perovskite Luminescent Nanocrystal
Application of Quantum Dot Composite Material
Light Emitting Diode Structure
Nitride Phosphor and Light Emitting Device and Backlight Module Employing the Nitride Phosphor
Light Emitting Device
White Light Emitting Device
Light-Emitting Module Structure
Pixel Structure
Light Emitting Diode Package
Pixel Circuit and Driving Method
Package Structure of Light-Emitting Element
Light Emitting Diode Structure and Method of Manufacturing Thereof
Wavelength Converting Material and Light Emitting Device
Light Emitting Device and Light Emitting Module
Low Blue Light Backlight Module
Patent:
11,294,238 →
Application:
17/083,328 →
Light Emitting Diode of Improved Light Extraction Rate
Optical Element and Light Emitting Device
Light-Emitting Package Structure
Picking Apparatus Capable of Picking Up Target Micro-Elements
Optical Sterilization Device
Display with Pixel Devices Emitting Light Simultaneously
Patent:
11,373,589 →
Application:
17/444,671 →
Wavelength Converting Material and Light Emitting Device
Light-Emitting Device
Light Emitting Diode Packaging Structure and Method for Manufacturing the Same
Light-Emitting Diode Structure with Reflective Layer for Improving Luminous Efficiency Thereof
Light Emitting Diode Structure
Light-Emitting Module Structure
Display Device and Manufacturing Method Thereof
Flip-Chip Light Emitting Diode Structure and Manufacturing Method Thereof
Light-Emitting Device and Backlight Module Thereof
Picking Apparatus with Heating Element and Temperature-Controlled Adhesive and the Method of Using the Same
Light Emitting Device with Two Vertically-Stacked Light Emitting Cells
Pixel Array Package Structure and Display Panel
Pixel Circuit
Display Device
Light Emitting Device, Package Device and Method of Light Emitting Device Manufacturing
Light Emitting Device and Module
Light Emitting Diode Package
Light Emitting Array Structure and Display
Light Emitting Module and Optical Lens Thereof
Light-Emitting Diode Device
Light Emitting Diode and Manufacturing Method Thereof
Light Emitting Diode Device
Light-Emitting Diode Structure for Improving Bonding Yield
Led Package Structure
Light Emitting Diode
Photodiode Package Structure with Shutters, Forming Method Thereof, and Wearable Device Having the Same
Light Emitting Device, Backlight, and Display Panel with Reflective Layer
Vertical Cavity Surface Emitting Laser Device
Method for Manufacturing Light Emitting Diode Packaging Structure
Optical Detection Apparatus
Flip-Chip Light Emitting Diode with Two Flat Pads
Light Emitting Diode Module
Patent:
995,454 →
Application:
29/755,332 →
Pixel Array Package Structure and Display Panel
Forming Method of Flip-Chip Light Emitting Diode Structure
Phosphate Phosphor, Light Emitting Device, and Detecting Device
Micro Led Structure and Display Device
Light Emitting Diode Device
Led Package Structure
Light Emitting Device, Backlight, and Display Panel with Reflective Layer
Light Emitting Diode Packaging Structure
Display Device and Driving Method Thereof
Light Emitting Diode Device
Light-Emitting Element and Display Device Using the Same
Light Emitting Diode Package
Diode Package Structure and Manufacturing Method Thereof
Wavelength Conversion Material, Method of Manufacturing Thereof and Light Emitting Device
Light Emitting Array Structure and Display
Light Emitting Device
Light Emitting Device
Light Emitting Element Package Including Subtrate with Edge Notch and Display Device Including Light Emitting Element Package
Electronic Component Sub-Mount and Electronic Device Using the Same
Led Package Structure
Quantum Dot Oil-Based Ink and Pattern Recognition System
Detection Device
Micro Led Structure and Display Device
Semiconductor Chip with Protruding Portion and Light-Emitting Device Having the Same
Diode Package Structure and Manufacturing Method Thereof
Light-Emitting Element
Light Emitting Diode Package, Divisional Display Module, and Display Panel
Pixel Package, Method for Forming the Same, and Display Device Using the Same
Pixel Array Package Structure and Display Panel
Light-Emitting Diode Device
Light Emitting Diode Structure
Method of Manufacturing Display Device
Light Emitting Diode Device
Light Emitting Diode Packaging Structure
Light-Emitting Diode Chip and Light-Emitting Diode Device
Light-Emitting Diode Display Device and Method of Manufacturing the Same
Optical Module
Pixel Unit and Manufacturing Method Thereof
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 28, 2024
From: CHENG, WEI-CHUNG; TIEN, YUN-YI; CHANG, JUNG-CHENG; CHIU, MIN-CHEN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 066270/0198 →
Assignment of Assignor's Interest
May 28, 2024
From: KUO, SHIOU-YI; SU, TSUNG-HAO; WANG, SHUN-HONG; MA, WEI-YUAN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 067543/0330 →
Assignment of Assignor's Interest
Jun 19, 2024
From: LIN, CHIH-HAO; WU, PO-HAN; SU, TSUNG-HAO; MA, WEI-YUAN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 067768/0518 →
Assignment of Assignor's Interest
Jul 22, 2024
From: LO, JIN-WEN; TSAI, YUN-JIE; HUNG, PIN-FENG; LAN, KUO-JEN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 068039/0392 →
Assignment of Assignor's Interest
Aug 22, 2024
From: PENG, SHU-CHING; SUNG, YU-HSI; CHANG, JUNG-CHENG; CHENG, WEI-CHUNG
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 068364/0449 →
Assignment of Assignor's Interest
Sep 9, 2024
From: KUO, SHIOU-YI; CHEN, BO-YU
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 068529/0831 →
Assignment of Assignor's Interest
Nov 6, 2024
From: CHENG, KAI-HUNG; LIN, KU-CHENG; LIN, CHUN-MIN; HSU, WEI-YI
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 069157/0924 →
Assignment of Assignor's Interest
Nov 11, 2024
From: CHENG, WEI-CHUNG; TIEN, YUN-YI; TSAI, HSIN-JUNG
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 069197/0513 →
Assignment of Assignor's Interest
Dec 29, 2024
From: HUNG, YU-PING; WENG, WEI-CHIEH; YU, ZONG-HAN; LIU, CHENG-YI
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 069694/0879 →
Assignment of Assignor's Interest
Jan 3, 2025
From: KUO, SHIOU-YI; LIANG, JIAN-CHIN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 069730/0019 →
Assignment of Assignor's Interest
Jan 22, 2025
From: YANG, YI-CHAN; WANG, WEN-SYUN; KUO, SHIOU-YI
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 069960/0518 →
Assignment of Assignor's Interest
Mar 5, 2025
From: LY, KIET TUONG; CHEN, FU-HSIN; LIN, CHUN-MIN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 070405/0910 →
Assignment of Assignor's Interest
Apr 25, 2025
From: KUO, SHIOU-YI; SU, TSUNG-HAO; WANG, SHUN-HONG; MA, WEI-YUAN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 070943/0632 →
Assignment of Assignor's Interest
Apr 25, 2025
From: KUO, SHIOU-YI; YANG, YI-CHAN; WANG, WEN-SYUN; CHEN, FU-HSIN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 070943/0505 →
Assignment of Assignor's Interest
Apr 29, 2025
From: KUO, SHIOU-YI; CHIU, JING-KAI; SU, TSUNG-HAO; MA, WEI-YUAN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 070969/0135 →
Assignment of Assignor's Interest
May 1, 2025
From: CHENG, HSU-WEN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 070994/0192 →
Assignment of Assignor's Interest
Jun 13, 2025
From: SHIH, KAI-HSIANG; TUNG, ZHENG-SHUO; TSAI, CHENG-YEH; CHANG, JUNG-CHIEN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071404/0967 →
Assignment of Assignor's Interest
Jun 18, 2025
From: KONG, SOH DENG; CHEN, FU-HSIN; TAI, WEN-WAN; LEE, YU-CHUN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071444/0393 →
Assignment of Assignor's Interest
Jun 19, 2025
From: CHENG, HSU WEN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071454/0593 →
Assignment of Assignor's Interest
Jun 19, 2025
From: LIN, CHUN-MIN; CHEN, JO-HSIANG; SU, HSIN-LUN; CHANG, HSUN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071454/0580 →
Corrective Assignment to Correct the Assignee Mailing Address Previously Recorded at Reel: 71404 Frame: 967. Assignor(S) Hereby Confirms the Assignment.
Jun 26, 2025
From: SHIH, KAI-HSIANG; TUNG, ZHENG-SHUO; TSAI, CHENG-YEH; CHANG, JUNG-CHIEN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071743/0610 →
Assignment of Assignor's Interest
Jul 7, 2025
From: KUO, SHIOU-YI
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071614/0232 →
Assignment of Assignor's Interest
Jul 10, 2025
From: CHEN, FU-HSIN; TANG, JUEI-HO; LIN, CHUN-MIN; CHENG, KAI-HUNG
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 071655/0916 →
Assignment of Assignor's Interest
Sep 11, 2025
From: LIN, CHIH-HAO; MA, WEI-YUAN; TSENG, JIN-SHING; YE, CHUN-XIN
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 072220/0575 →