Light emitting diode
View Patent ↗A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.
1. A light emitting diode, comprising:
a light emitting chip;
a non-conductive casing; and
a frame supported by the casing, the frame comprising a first portion having a first thickness supporting the light emitting chip within the casing, and a second portion having a second thickness extending from the first portion and having a distal tip protruding through an opening on a side of the casing to expose the distal tip outside of the casing, wherein the second thickness is substantially less than the first thickness, and wherein the first and the second portions are electrically connected and substantially in a same plane.
2. The light emitting diode as claimed in claim 1 , wherein the casing comprises a side wall defining an interior region, the first portion supports the light emitting chip in the interior region, and the second portion extends and protrudes through an opening in the side wall to expose the distal tip outside the side wall.
3. The light emitting diode as claimed in claim 2 , wherein the distal tip of the second portion terminates substantially flush with an outside surface of the side wall.
4. The light emitting diode as claimed in claim 2 , wherein the first portion has a top surface and a bottom surface defining the first thickness, and wherein the top surface supports the light emitting chip and the bottom surface is exposed by an opening at a bottom of the casing.
5. The light emitting diode as claimed in claim 4 , wherein the bottom surface protrudes through and beyond the opening at the bottom of the casing.
6. The light emitting diode as claimed in claim 1 , wherein the frame further comprises an electrode supported by the casing substantially in a same plane as the second portion, wherein the electrode is electrically separated from the first portion and is conductively connected to the light emitting chip.
7. The light emitting diode as claimed in claim 6 , wherein the electrode comprising a terminal portion extending to outside of the casing.
8. The light emitting diode as claimed in claim 6 , wherein the electrode further comprises in addition at least a support portion terminating at an end exposed outside of an external wall of the casing.
9. The light emitting diode as claimed in claim 8 , wherein the distal tip of the second portion and the support portion of the electrode terminate substantially flush with a same outside surface of the casing.
10. The light emitting diode as claimed in claim 1 , wherein the non-conductive casing has an accommodation access receiving the light emitting chip.
11. A light emitting diode, comprising:
a light emitting chip;
a non-conductive casing; and
a frame supported by the casing, the frame comprising a first portion having a first thickness supporting the light emitting chip within the casing, and a second portion having a second thickness extending from the first portion and having a distal tip protruding through an opening on a side of the casing to expose the distal tip outside of the casing, wherein the second thickness is substantially less than the first thickness, wherein the frame further comprises an electrode supported by the casing substantially in a same plane as the second portion, wherein the electrode is electrically separated from the first portion and is conductively connected to the light emitting chip, and wherein the electrode is separated by a gap from the first portion and the second portion, respectively.
12. A light emitting diode, comprising:
a light emitting chip;
a non-conductive casing;
a frame supported by the casing, the frame comprising a first portion having a first thickness supporting the light emitting chip within the casing, and a second portion having a second thickness extending from the first portion and having a distal tip protruding through an opening on a side of the casing to expose the distal tip outside of the casing, wherein the second thickness is substantially less than the first thickness, and wherein the non-conductive casing has an accommodation access receiving the light emitting chip; and
a packaging polymer received in the accommodation recess to encapsulate the light emitting chip.