IP Library Granted Patent US 11,367,849
Granted Patent B2
US 11,367,849 · App. 16/232,041 · Granted Jun 21, 2022

Pixel array package structure and display panel

Inventors: Hui-Ru Wu (Miaoli County, TW); Jian-Chin Liang (Hsinchu, TW); Jo-Hsiang Chen (New Taipei, TW); Lung-Kuan Lai (Hsinchu County, TW); Cheng-Yu Tsai (Changhua County, TW); Hsin-Lun Su (Taichung, TW); Ting-Kai Chen (Hsinchu, TW)
Assignee: Lextar Electronics Corporation
H01L51/5036H01L33/60H01L51/5271H01L51/5284H01L51/5293
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Quick Facts
Patent No.
US 11,367,849
App. No.
16/232,041
Granted
Jun 21, 2022
Kind
B2
Abstract

A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

Claims (15)

1. A pixel array package structure, comprising:

a substrate;

a pixel array disposed on the substrate, wherein the pixel array comprises a plurality of light emitting diode chips, and the plurality of light emitting diode chips comprise at least one red diode chip, at least one green diode chip, and at least one blue diode chip;

a reflective layer disposed on the substrate and between any two adjacent of the plurality of light emitting diode chips;

a light-transmitting layer disposed on the pixel array and covering a portion of the reflective layer located on a periphery of the pixel array, wherein the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the plurality of light emitting diode chips of the pixel array and the reflective layer between any two adjacent of the plurality of light emitting diode chips, and the upper surface has a roughness of 0.005 mm to 0.1 mm; and

a light-absorbing layer disposed on the reflective layer and surrounding the light-transmitting layer, wherein the upper surface of the light-transmitting layer is substantially coplanar with an upper surface of the light-absorbing layer, and the light-transmitting layer is not separated by the light-absorbing layer, wherein a lower surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array, and a vertical projection of the light-absorbing layer on the substrate surrounds a vertical projection of the whole pixel array on the substrate.

2. The pixel array package structure of claim 1 , wherein the light-absorbing layer is composed of a colloidal material and an inorganic material, or a colloidal material and an organic material.

3. The pixel array package structure of claim 2 , wherein the inorganic material is carbon powder or perovskite.

4. The pixel array package structure of claim 3 , wherein the carbon powder has a specific surface area of 50 m 2 /g to 70 m 2 /g.

5. A pixel array package structure, comprising:

a substrate;

a pixel array disposed on the substrate, wherein the pixel array comprises a plurality of light emitting diode chips, and the plurality of light emitting diode chips comprise at least one red diode chip, at least one green diode chip, and at least one blue diode chip;

a reflective layer disposed on the substrate and between any two adjacent of the plurality of light emitting diode chips;

a light-transmitting layer disposed on the pixel array and covering a portion of the reflective layer located on a periphery of the pixel array, wherein the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the plurality of light emitting diode chips of the pixel array and the reflective layer between any two adjacent of the plurality of light emitting diode chips, and the upper surface has a roughness of 0.005 mm to 0.1 mm; and

a light-absorbing layer disposed on the reflective layer and surrounding the light-transmitting layer, wherein the upper surface of the light-transmitting layer is substantially coplanar with an upper surface of the light-absorbing layer, and a lower surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array, wherein the light-absorbing layer only covers a portion of the reflective layer located at the periphery of the pixel array.

Assignments (2)
MERGER Recorded Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2018
From: WU, HUI-RU; LIANG, JIAN-CHIN; CHEN, JO-HSIANG; LAI, LUNG-KUAN; TSAI, CHENG-YU; SU, HSIN-LUN; CHEN, TING-KAI
To: LEXTAR ELECTRONICS CORPORATION
Reel/Frame 047850/0881 →
Cited By (1)
US 12,300,775