Light-emitting diode package including a cavity with a plurality of side-walls with different inclinations
View Patent ↗An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.
1. A light-emitting diode package, comprising:
a lead-frame having a horizontal surface;
at least a light-emitting diode chip, disposed on the horizontal surface of the lead-frame and electrically connected to the lead-frame; and
an encapsulant, encapsulating the light-emitting diode chip and a part of the lead-frame, wherein a part of the lead-frame is exposed out of the encapsulant, the encapsulant comprising:
a casing, having a first cavity, wherein the light-emitting diode chip is located in the first cavity, and the first cavity has a plurality of side-walls with different inclinations, respectively, wherein the inclinations are not orthogonal to the horizontal surface of the lead-frame in such a manner as to provide an increased light-emitting efficiency; and
a first light-transmitting portion, disposed in the first cavity and joined with the casing, wherein the first light-transmitting portion encapsulates the light-emitting diode chip and a partial region of the lead-frame not encapsulated by the casing.
2. The light-emitting diode package according to claim 1 , wherein the lead-frame has a roughened surface, and the roughened surface is suitable to scatter the light emitted from the light-emitting diode chip.
3. The light-emitting diode package according to claim 2 , wherein the roughened surface has a roughness ranging from 0.05 μm to 500 μm.
4. The light-emitting diode package according to claim 1 , wherein the lead-frame comprises a plurality of leads, each of the leads comprises an inner-lead and an outer-lead, the inner-lead is encapsulated by the encapsulant and electrically connected to the light-emitting diode chip, and the outer-lead is exposed out of the encapsulant.
5. The light-emitting diode package according to claim 4 , wherein each of the inner-leads has the roughened surface.
6. The light-emitting diode package according to claim 4 , wherein each of the inner-leads and each of the outer-leads have the roughened surface.
7. The light-emitting diode package according to claim 4 , wherein each of the outer-leads is extended from the side-wall of the encapsulant to below the bottom of the encapsulant.
8. The light-emitting diode package according to claim 4 , wherein the partial regions of the inner-leads encapsulated by the first light-transmitting portion respectively have the roughened surface.
9. The light-emitting diode package according to claim 8 , wherein the partial regions of the inner-leads encapsulated by the casing respectively have the roughened surface.
10. The light-emitting diode package according to claim 1 , further comprising a second light-transmitting portion, wherein the casing further has a second cavity for accommodating an electronic device and the second light-transmitting portion that is located in the second cavity and connected to the casing, the second light-transmitting portion encapsulates the electronic device and a partial region of the lead-frame not encapsulated by the casing, and the first light-transmitting portion and the second light-transmitting portion are respectively positioned at two opposite sides of the lead-frame.
11. The light-emitting diode package according to claim 10 , wherein the first cavity has a greater dimension than the second cavity does.
12. The light-emitting diode package according to claim 10 , wherein the electronic device comprises a light-emitting diode chip, an electrostatic protection chip, or a control chip.
13. A light-emitting diode package, comprising:
a lead-frame having a horizontal surface and comprises a plurality of leads, each of the leads comprises an inner-lead and an outer-lead;
at least a light-emitting diode chip, disposed on the horizontal surface of the lead-frame and electrically connected to the lead-frame; and
an encapsulant, encapsulating the light-emitting diode chip and the inner-lead, comprising:
a casing, having a first cavity, wherein the light-emitting diode chip is located in the first cavity, and the first cavity has a plurality of side-walls with different inclinations along a vertical direction, wherein included angles between each said inclination and the horizontal surface of the lead-frame are not orthogonal and increases in the vertical direction away from the horizontal surface of the lead-frame; and
a first light-transmitting portion, disposed in the first cavity and joined with the casing, wherein the first light-transmitting portion encapsulates the light-emitting diode chip and a partial region of the lead-frame not encapsulated by the casing;
wherein the inner-lead is electrically connected to the light-emitting diode chip, and wherein each of the outer-leads is extended from the side-wall of the encapsulant to below the bottom of the encapsulant.
14. The light-emitting diode package according to claim 13 , wherein each of the inner-leads has a roughened surface, the roughened surface has a roughness ranging from 0.05 μm to 500 μm.
15. The light-emitting diode package according to claim 13 , wherein each of the inner-leads and each of the outer-leads have a roughened surface, the roughened surface has a roughness ranging from 0.05 μm to 500 μm.
16. The light-emitting diode package according to claim 13 , wherein the partial regions of the inner-leads encapsulated by the first light-transmitting portion respectively have the roughened surface.
17. The light-emitting diode package according to claim 16 , wherein the partial regions of the inner-leads encapsulated by the casing respectively have the roughened surface.
18. The light-emitting diode package according to claim 13 , further comprising a second light-transmitting portion, wherein the casing further has a second cavity for accommodating an electronic device and the second light-transmitting portion that is located in the second cavity and connected to the casing, the second light-transmitting portion encapsulates the electronic device and a partial region of the lead-frame not encapsulated by the casing, and the first light-transmitting portion and the second light-transmitting portion are respectively positioned at two opposite sides of the lead-frame.
19. The light-emitting diode package according to claim 18 , wherein the first cavity has a greater dimension than the second cavity does.
20. The light-emitting diode package according to claim 18 , wherein the electronic device comprises a light-emitting diode chip, an electrostatic protection chip, or a control chip.